IPC-A-610國(guó)際標(biāo)準(zhǔn)中英文對(duì)照(doc 17)

1、IPC-A-610國(guó)國(guó)際標(biāo)準(zhǔn)中英文對(duì)對(duì)照4.6.2 Heat sink-Contact散熱片接觸片arget-Class 1,2,3目標(biāo)等級(jí)1,2,3 Component and heatsink are in full contact with the C。mounting surface. 組件和散熱片與安裝表表面完全接觸 Hardware meets specified attachment requirements.M。部件滿足規(guī)定的接觸要要求。Figure圖4-641. Heat sink散熱片Acceptable-Class 1,2,3可接受的 等級(jí)1,2,3 Component

2、not flush. 組件不平齊 Minimum 75% contact with mounting surface. T。至少有75%與安裝表表面接觸 Hardware meets mounting torque requirements if e。specified.如果有規(guī)定，部件滿足足安裝的轉(zhuǎn)距要求求Figure圖4-65 1. Gap 2. Heat sink間隙 散熱熱片 Defect-Class 1,2,3缺點(diǎn)等級(jí)1,2,3 Component is not in contact with mounting surface. l。組件沒有接觸到安裝表表面 Hardware is

3、loose and can be moved.e。部件松弛可以移動(dòng)。Figure圖4-661. Heat sink 2. Gap散熱片 間隙5.1 Orientation方向5.1.1 Orientation-Horizontal方向水平Target-Class 1,2,3目標(biāo)等級(jí)1，2，3Components are centered between their lands. 6。組件位于焊盤中央Component markings are discernible.U。組件標(biāo)識(shí)清晰可見Nonpolarized components are oriented so that U。marking

4、s all read the same way (left-to-rightz。or top-to-bottom).Figure圖5-1 無極性組件的的方向應(yīng)使其標(biāo)識(shí)識(shí)都能按同樣方式式進(jìn)行辨識(shí)e。（從左到右或從上到下下）Acceptable-Class 1,2,3可接受的等級(jí)1，2，3Polarized and multilead components are orientedX。correctly.有極性和多引腳的組件件應(yīng)按正確方向安安裝。When hand formed and hand-inserted, polarizationN。symbols are discernible.當(dāng)手工

5、成型及手插件時(shí)時(shí)，極性符號(hào)可以以辨識(shí)。All components are as specified and terminate to m。 Figure圖 5-2 correct lands.h。所有組件都符合規(guī)定并并連接到正確的焊焊盤上。Nonpolarized components do not need to be oriented so that markings all read the same way(left-to right or top to-bottom).b。無極性的組件不需要按按同樣的方向，只只要標(biāo)識(shí)可按相同同方向辨識(shí)即可（從從左到右或從上到到下）.G。5.1.1

6、Orientation-Horizontal(cont.)3。方向水平（續(xù)）Defect-Class 1,2,3缺點(diǎn)等級(jí)1，2，3Component is not as specified (Wrong part). R。組件不符合規(guī)定（組件件錯(cuò)誤）Component not mounted in correct holes. G。組件沒有安裝在正確的的孔中。Polarized component mounted backwards.d。 有極性組件安裝方方向相反。Multileaded component not oriented correctly.L。 Figure圖 5-3 多引腳腳組

7、件的安裝方向向不正確。q。5.1.2 Orientation-Vertical方向垂直Target-Class 1,2,3目標(biāo)等級(jí) 1，2，3Nonpolarized component markings read from the top B。down.無極性組件的標(biāo)識(shí)可以以從上至下辨識(shí)Polarized markings are located on top.o。極性標(biāo)識(shí)位于頂部.Figure圖 5-4 Acceptable-Class 1,2,3可接受的等級(jí) 1，2，3Polarized part is mounted with a long ground lead.1。極性組件安裝時(shí)有

8、長(zhǎng)的的接地引腳Polarized marking hidden.極性標(biāo)識(shí)被隱藏起來Nonpolarized component markings read from bottom to j。top.無極性組件標(biāo)識(shí)可以從從底至上辨識(shí)。Figure圖 5-5Defect-Class 1,2,3缺點(diǎn)等級(jí) 1，2，3Polarized component is mounted backwards.v。極性組件安裝反向。Figure圖 5-65.2 Mounting 安裝5.2.1 Mounting-Horizontal-Axial Leaded-Supported HolesR。安裝水平軸向向引腳有支

9、撐孔Target-Class 1,2,3目標(biāo)等級(jí)1，2，3The entire body length of the component is in1。contact with the board surface.M。整個(gè)組件本體長(zhǎng)度與線線路板表面完全接接觸Components required to be mounted off the board are ,at least 1.5mm0.059 infrom the board surface; e.g., high heat dissipating.8。需要離開線路板表面安安裝的組件至少要要離開線路板Figure圖 5-7 平面1.5m

10、m（0.059 in），如高散熱器件.i。 Figure圖 5-85.2.1 Mounting-Horizontal-Axial Leaded-Supported Holes(cont.)5。安裝水平軸對(duì)對(duì)稱引腳有支撐孔Acceptable-Class 1,2可接受的等級(jí)1，2，3The maximum space between the component and theK。board surface does not violate the requirements for v。lead protrusion(see 5.2.7)or component height(H). k。Figu

11、re圖 5-9 (H) is a user-determined dimension.)V。組件與線路板平面之間間的最大間距不應(yīng)應(yīng)違反引腳突出（見見5.2.7）或組組件高度（H）的要求。 （高度（H）是由使用者決決定的尺寸）M。Process Indicator-Class 3程序指示等級(jí)3The farthest distance between the component body and the board(D) is larger than 0.7mm0.028 in. W。組件本體與線路板之間間的最大的距離（D）超過0.7mm（0.028 in）。1。Defect-Class 1,2

12、,3缺點(diǎn)等級(jí)1，2，3Components required to be mounted above the board surface are less than 1.5mm0.059 inY。 要求離開線路板板表面安裝的組件件與線路板的距離離小于1.5mm（0.059 in）.c。5.2.2 Mounting-Horizontal-Axial Leaded-Unsupported HolesA。安裝水平軸向向引腳無支撐的孔Target-Class 1,2,3目標(biāo)等級(jí)1.2.3The entire body length of the component is in s。contact wi

13、th the board surface.a。整個(gè)組件本體長(zhǎng)度與線線路板表面完全接接觸.Components required to be mounted off the board arek。at minimum 1.5mm0.059 in from the boardp。Figure圖 5-10 surface ;e.g. ,high heat dissipating.t。1.No Plating in barrel 需需要離開線路板表表面安裝的組件至至少要離開線路板板平x。孔壁上沒有電鍍 面1.5mm（0.059 in），如高散熱器件. 3。 Components required to

14、 be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land.a。需要離開線路板安裝的的組件在線路板表表面利用引腳形狀狀或其它機(jī)械支撐撐來防止焊盤的翹翹起。p。 Figure圖 5-11 Figure圖 5-12y。Lead forms 引腳形形狀Defect-Class 1,2,3缺點(diǎn)等級(jí)1，2，3Components required to be mounted off the

15、board are t。not provided with lead forms at the board surface A。or other mechanical support to prevent lifting of E。solder land.Figure圖 5-13 需要離開面面板安裝的組件在在線路板表面未利利用引腳的形狀或或其它機(jī)械支撐來來防止焊盤翹起l。surface Components required to be mounted above the board are less than 1.5mm0.059 in.4。要求離開線路板表面安安裝的組件與線路路板的距離小于

16、1.5mm（0.059 in）l。Figure圖 5-145.2.3 Mounting-Horizontal-Radial Leadedw。安裝水平徑向向引腳Target-Class 1,2,3目標(biāo)等級(jí)1，2，3The component body is in flat contact with s。 the boards surface.組件本體與線路板表面面平貼接觸 Bonding material is present, if required .See4.4.0。若需要，則可存在粘貼貼的物質(zhì)，見4.4Figure圖 5-15Acceptable-Class 1,2,3可接受的等級(jí)1，2

17、，3Component in contact with board on at least oneD。 side and/or surface.組件與線路板至少有一一邊和/或面接觸。Note: When documented on an approved assembly x。drawing, a component may be either side mountedH。or end mounted. The side or surface of the body, or ati。least one point of any irregularly ponent

18、(such as certain pocketbook capacitors), needsh。Figure圖 5-16 to be in full contact with the printed board. The body K。should to be bonded or otherwise retained to the board to prevent damage when vibration and shock forces are applied.b。注意： 在被認(rèn)可的組組裝圖中，一個(gè)組組件既可能是面安安裝也可能是邊沿沿安裝。組件體的的表面或側(cè)面，或或不規(guī)則形狀組件件的至少一

19、點(diǎn)（如如某種袖珍電容），需需要與印刷線路板板完全接觸。組件件本體應(yīng)粘貼或保保持在線路板上以以防止在震動(dòng)或撞撞擊時(shí)損壞。3。Defect-Class 1,2,3缺點(diǎn)等級(jí)1，2，3Unbonded component body not in contact withG。mounting surface.未粘貼的組件本體沒有有和安裝表面接觸觸。Bonding material not present if required.u。在有要求時(shí)，卻沒有粘粘貼物質(zhì)。Figure圖 5-17.2.4 Mounting-Vertical-Axial Leaded-Supported HolesG。安裝垂直軸向向

20、引腳有支撐的孔Target-Class 1,2,3目標(biāo)等級(jí)1，2，3The height of the component body above the land,l。(H)is 0.4mm0.016 into1.5mm 0.059 in.O。組件本體距離焊盤的高高度，（H）為0.4mm（0.016in） 到 6。1.5m（0.059in）之之間。The component body is perpendicular to the board. v。組件本體與線路板垂直直Figure圖 5-18 The overall height does not exceed the height specified. i。總的高度未超過規(guī)定的的高度.Acceptable-Class 1,2,3可接受的等級(jí)1，2，3The component height above the board,(H)is not i。outside the range given in Table 5-1.U。組件