鋁基板生產(chǎn)作業(yè)指導(dǎo)書

...wd......wd......wd...景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第5頁共18頁5of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDate1.0目的Purpose標(biāo)準鋁基板批量生產(chǎn)的操作，提升鋁基板的品質(zhì)檔次。ToregulatemassproductionoperationofaluminousPCBandtoimprovethequalityofaluminousPCB2.0鋁基板簡介IntroductionofAluminousPCB2.1性能和應(yīng)用FunctionandApplication鋁基板是一種散熱性能良好的絕緣金屬基敷銅板,其特點在于：AluminousPCBisakindofinsulatedmetal-basedcopperboardwithhighthermaldiffusivity.Itscharacteristicsareasbelow:2.1.1良好的導(dǎo)熱性能有助于元器件的冷卻;Goodheatconductivityhelpstocoolcomponents.2.1.2較高的絕緣強度能夠經(jīng)受高達6KVAC電壓；HighinsulatedcapacitycanmakealuminousPCBbear6KVACpressure.由于上述種種優(yōu)越性能，鋁基板被廣泛應(yīng)用于電源控制等方面。Duetothecharacteristicsabove,aluminousPCBiswidelyusedintheaspectofpowercontrol.2.2構(gòu)造Structure2.2.1一般的金屬基板分為三層：線路層、絕緣層和金屬基層。Generallyspeaking,aluminousPCBisdividedintothreelayers:circuitlayer,insulatedlayer&metallayer.線路層一般采用電解銅箔，常用厚度有1OZ、2OZ、3OZ、4OZ等4種；絕緣層一般為填充了陶瓷的聚合物，其常用厚度為75m、150m；金屬基層一般有鋁基、銅基、鐵基、CIC、CMC等，常用厚度為1.0mm、1.6mm、2.0mm、Circuitlayeriscommonlyusedelectrolyzedcopperfoilwiththicknessof1OZ,2OZ,3OZand4OZ.Insulatedlayerisoftenakindofpolymerfullofceramicswiththicknessof75mand150m.MetallayerusuallyincludesAl-basedboard,Cu-basedboard,Te-basedboard,CICandCMCetc.withthicknessof1.0mm,1.6mm,2.0mmand2.2.2為了保護鋁面不被擦花、氧化，也有助于生產(chǎn)過程前面工序的控制，一般的鋁基板鋁面貼有保護膜；景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第6頁共18頁6of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateInordertoavoidscratchesandoxidationofAlsurfaceandtocontrolpre-processduringproduction,theAlsurfaceofAluminousboardisusuallypastedwithalayerofprotectivefilm.2.2.3金屬基板有單面、雙面之分。以Bergquist公司提供的單面鋁基板為例，其構(gòu)造如下列圖，具體參數(shù)為：Metal-basedaluminousboardisdividedintosingle-sidedoneanddouble-sidedone.Takingthesingle-sidedaluminousboardsuppliedbyBergquistasanexample,itsstructureandconcreteparametersareasbelow:銅箔厚度：4OZ絕緣層厚度：75um鋁基厚度：1.0mm、1.2mm、1.6mmCopperfoilthickness:4OZInsulatedlayerthickness:75umAlbasethickness:1.0mm,1.2mm&1.6mm2.3標(biāo)準尺寸StandardDimensionBergquist公司鋁基板的標(biāo)準尺寸有18″X24″和16″X19″兩種，其有效利用尺寸分別為17″X23″和15″X18″；我司常用工作板尺寸為18″X24″。ThestandarddimensionsofBergquistaluminousboardsaredividedinto18″X24″and16″X19″withvaliddimensionsof17″X23″and15″X18″respectively.ThedimensionofKinwongworkingboardis18″X24″.注：其它供應(yīng)商或客戶指定之鋁基板，根據(jù)實際情況而定。Remark:Thealuminousboardofferedbyothersuppliersorappointedbycustomersisdependentonrealsituation.2.4設(shè)計要點MainPointsofDesign為了有效地防止或減少鋁基板使用過程中的漏電問題，在圖形設(shè)計過程中要保證以下安全距離：Inordertoeffectivelyavoidordecreasethecreepageproblemduringaluminousboarduse,itisnecessarytokeepasafedistanceduringpatterndesignasbelow:孔邊到線路邊緣的距離最小值為T(T為板材厚度)TheminimumdistancebetweenholeandcircuitedgeisT(t=basematerialthickness).板邊到線路邊緣的距離最小值為TTheminimumdistancebetweenboardedgeandcircuitedgeisT.孔邊到板邊的最小距離為TTheminimumdistancebetweenholeandboardedgeisT.景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第7頁共18頁7of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDate沖孔最小孔徑為TTheminimumhole-diameterforpunchingisT.倒角圓弧半徑最小值為TTheminimumsemi-diameterofroundingcirculararcisT.3.0鋁基板制程噴錫流程：來料檢查→一次沖/鉆孔→圖形轉(zhuǎn)移→圖形檢查→蝕刻→退膜→蝕檢→阻焊制作→打定位孔→字符制作→噴錫→噴錫檢查→單面磨板〔視客戶要求而定〕→V-CUT/成型→通斷測試→高壓測試→FQC、FQA→包裝入庫HALSProcess：IQC→One-timehole-punching/drilling→ImageTransfer→ImageCheck→Etching→Film-stripping→EtchingCheck→SolderMaskMaking→Orientation-holePunching→ComponentMarkMaking→HALS→HALSCheck→Single-sideScrubbing〔accordingtocustomer’srequirements〕→V-CUT/Moulding→Open/ShortTest→High-pressureTest→FQC、FQA→PackingOSP流程：來料檢查→一次沖/鉆孔→圖形轉(zhuǎn)移→圖形檢查→蝕刻→退膜→蝕檢→→阻焊制作→打定位孔→字符制作→V-CUT/成型→測試→FQC、FQA→OSP→FQC→包裝入庫OSPProcess：IQC→One-timehole-punching/drilling→ImageTransfer→ImageCheck→Etching→Film-stripping→EtchingCheck→SolderMaskMaking→Orientation-holepunching→ComponentMarkMaking→V-CUT/Moulding→Test→FQC、FQA→OSP→FQC→Packing3.1來料檢查IQCA銅面檢查：不允許有凹坑、擦花和嚴重氧化痕跡；Cusurfacecheck:Notches,scratchesandseriousoxidationarenotallowed.B保護膜檢查：保護膜不應(yīng)有破損至鋁面露出；Protectivefilmcheck:Protectivefilmmustn’tbebrokenwithCuexposure.C厚度檢查：按流程卡要求檢測板厚、銅厚。Thicknesscheck:CheckboardthicknessandCuthicknessaccordingtolotcard.3.2一次沖/鉆孔One-timeHole-punching/drillingA一次沖/鉆孔主要沖管位孔和工藝孔，孔位和孔徑均要符合圖紙要求；景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第8頁共18頁8of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateOne-timehole-punching/drillingismainlytopunchorientation-holeandtechnicalhole.Thehole-positionandhole-diametermustbeconsistentwithdrawingrequirement.B沖/鉆板方向為從銅面到鋁面，可有效防止鋁面擦花；Punching/drillingdirectionisfromCusurfacetoAlsurface,whichcaneffectivelyavoidscratchesofAlsurface.3.3圖形轉(zhuǎn)移ImageTransferA磨板Scrubbinga為提高干膜和保護膜面的結(jié)合力，防止保護膜面干膜脫落，可輕磨保護膜面；Inordertoimprovethecombinationofdryfilm&protectivefilmandtoavoidfallingoffdryfilmontheprotectivefilm,itisnecessarytolightlyscrubthesurfaceofprotectivefilm.b不允許有板面氧化和膠漬現(xiàn)象。Oxidationandleftgluestainsontheboardsurfacecannotbeallowed.B貼膜FilmPastinga干膜種類：AQ-5038；Dryfilmtype:AQ-5038b預(yù)烘和貼膜時間間隔要盡量短。Theintervalbetweenpre-cureandfilm-pastingtimeshouldbeasshortaspossible.C靜置冷卻PlacingandCooling為了對位的準確，須將已貼膜的鋁基板靜置冷卻至室溫。Inordertoassureaccurateregistration,itisnecessarytoplacealuminousboardwithpastedfilmforawhileuntilitreachesroomtemperature.D曝光Exposinga負片黃菲林；NegativeYellowFilmb注意絲印孔對位的準確性。Payattentiontotheregistrationaccuracyofsilk-screeninghole.E靜置Placing線路局部發(fā)生光聚反響,經(jīng)15min左右充分聚合。Thelight-gatheringreactionhappensatthecircuitpartandreachesfullaggregationafter15minutes.景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第9頁共18頁9of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateF顯影Developing3.4圖形檢查ImageCheckA檢查重點在于開路、短路、缺口、顯影不凈等；Mainlycheckopencircuit,shortcircuit,gapanduncleandevelopingetc.B修板時不能用黑油筆，只能用黑油補；Blackoil-pencannotbeusedwhenmendingboardbutblackoil.3.5蝕刻EtchingA必須在首板試驗合格方可批量生產(chǎn)；Itisobligatorytoconductmassproductionafterthefirstbatchofboardsisconfirmedtobequalified.B蝕刻放板時，線路面向下，同時關(guān)掉機器的上噴嘴；Putthecircuitsideadownwhenplacingboardsforetchingandturnoffthesprayingheadonthemachineatthesametime.C不允許有保護膜破損現(xiàn)象，如發(fā)現(xiàn)保護膜破損，則應(yīng)先用皺紋膠貼好再過機蝕刻；Thedilapidationofprotectivefilmisnotallowedandiftheprotectivefilmisbroken,itshoulduseadhesivetapetomenditbeforeplacingboardsontheetchingmachine.D盡量控制一次蝕刻干凈；Assureone-timecleanetchingaspossibleasitcan.E圖形內(nèi)任何地方的殘銅或絕緣層上的垃圾都不允許用刀片來刮；UsingknifetoscrapeoffleftCuonanypartofthepatternorthedirtontheinsulatedlayerisnotallowed.3.6退膜/清洗Film-stripping/CleaningA退膜不能浸泡在退膜缸中，必須直接過機退膜，一次性退膜干凈；B退膜過程中殘留在板面的藥水會影響鋁基板成品的耐用程度，故需對剝膜后的鋁基板進展有效的清洗；C退膜干凈后的鋁基板必須進展烘干處理前方可往下流程；D所有鋁基板均不能進展手動蝕刻；E如有蝕刻不凈的板子，可進展快速過機返蝕，蝕刻壓力：0.1-0.5kg/cm2，蝕刻速度：景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第10頁共18頁10of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDate5000mm/min，但返蝕次數(shù)最多不可超過2次。3.7蝕刻檢查EtchingCheckA絕緣層上的任何地方都不允許用刀片來刮；Usingknifetoscratchanypartoftheinsulatedlayerisnotallowed.B主要檢查短路、缺口、開路，報廢單元不能鉆孔，只能用黑油筆打“╳〞；Mainlycheckshortcircuit,gap,opencircuit.Abandonedunitmustn’tbedrilledandcanonlybemarkedwith“X〞byblackoil-pen.3.8阻焊制作SolderMaskMakingA單面磨板〔線路面〕，不允許板面有氧化和膠漬現(xiàn)象；Single-sidescrubbing(circuitside).Oxidationandgluestainsontheboardsurfacearenotallowed.B待板子冷卻至室溫后印阻焊Printsoldermaskaftertheboardiscooledintoroomtemperature.C待鋁基板冷卻至室溫后，方可對位曝光；RegisterandexposealuminousPCBafteritiscooledintoroomtemperature.a對位前應(yīng)認真檢查板面是否有感光油堆積及不均勻，如有且多則應(yīng)及時返工；Beforeregistration,itisnecessarytoseriouslycheckifthesensitizationoilaccumulatesontheboardsurfaceorisuneven.Ifthereisalotofsensitizationoilontheboardsurface,itmustre-processsuchboardsintime.b對位時應(yīng)注意菲林與板面MARK點的同心度；Duringregistration,itisnecessarytopayattentiontotheconcentricityofthefilmandmarkpoint.D曝光；ExposingE顯影；DevelopingF檢查：重點檢查顯影不凈和綠油上焊盤；Check:MainlycheckuncleandevelopingandsoldermaskonthePAD.G無特殊要求的板在顯影后須撕掉鋁面保護膜，鋁面不能有膠漬和保護膜殘留；ItmustripofftheprotectivefilmontheAlsurfaceafterdevelopingforunspecializedboards.GluestainsandprotectivefilmleftoverontheAlsurfacearenotallowed.注：假設(shè)有特殊要求，則在顯影后及全制程都不可撕掉鋁面保護膜；景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第11頁共18頁11of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateRemark:Ifthecustomerhasspecialrequirements,theprotectivefilmmustn’tberippedoffafterdevelopingevenduringthewholeproduction.H返洗綠油板返洗綠油前不能撕掉鋁面保護膜，并檢查有無破損，如有必須用皺紋膠紙貼好。Theprotectivefilmcannotberippedoffbeforewashingoffsoldermaskforre-processandshouldbecheckedifisbroken.Iftheprotectivefilmisbroken,itmustbemendedwithadhesivetape.I如下工序為打定位孔工序必須先固化阻焊后在送板下工序。3.9打定位孔Orientation-holePunchingA用層壓打靶在做好的線路相應(yīng)靶位圖上打靶。Punchorientation-holeatcorrespondingpositionoftheboardwithfinishedcircuitsbylayer-pressingpunchingB孔位偏差≤0.075mm，孔徑3.175mm。Thehole-positiontoleranceis≤0.075mmandthehole-diametertoleranceis3.175mm.3.10字符制作(根據(jù)MI要求而定)ComponentMarkMaking(basedontherequirementofMI)A每印一塊工作板后都需認真自檢，合格后再繼續(xù)印刷，不合格板需分開及時返工；Conductself-checkforeveryprintedworkingboardandcontinueprintingwhenthepreviousoneisconfirmedtobequalified.Unqualifiedboardsmustbeseparatedfromqualifiedonesandbere-processedintime.B字符不允許有模糊、重影、殘缺、滲油等現(xiàn)象；Componentmarkmustn’tbeambiguous,broken,oil-seepedorwithghostimage.3.11噴錫HALSA錫爐溫度控制在240~26TheTin-oventemperatureiscontrolledwithin240~26B噴錫后要充分冷卻前方可進展后處理；Conductpost-treatingwhentheboardisfullycooledafterHALS.C后處理的熱水洗段要將板面充分清洗干凈，防止板面啞色；Completelycleantheboardsurfaceatthehot-waterwashingsectionofthepost-treatingtoavoiddimcoloroftheboardsurface.3.12噴錫檢查HALSCheck景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第12頁共18頁12of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateA錫面平整，無錫堆、錫高等現(xiàn)象；TheTinsurfacemustbesmoothwithoutTin-pilingandhighTin.B所有焊點不允許有不上錫現(xiàn)象；AssureallsolderpointsarecoveredwithTin.CMARK點一定要平整，不允許錫面凸出或錫面不均勻；AllMARKpointsmustbesmooth.ItisnotallowedthattheTinsurfaceisprotrudedoruneven.D錫面顏色一致，光亮度要好，不允許有啞色；ThecolorofTinsurfacemustbeunifiedwithgoodbrightnessandnodimcolor.3.13單面磨板〔視客戶要求而定〕Single-sideScrubbing(accordingtocustomer’srequirements)A磨板前要徹底洗機、換水，水洗缸不能含有任何酸液；Completelycleanthemachineandchangedirtywaterbeforescrubbingandtheremustbenoacidliquidinwashingtank.B磨刷使用氈轆，前磨刷為500#，后磨刷為800#，磨痕試驗寬度為8~15mmUsingfelttackleforscrubbing.Thetypeofformerscrubbingbrushis500#andthelatteris800#.Thetestedwidthofscrubbingtraceiswithin8~15mmC磨板前要注意清洗烘干段行轆；Payattentiontocleaningtransportingtackleatthebakingsectionbeforescrubbing.D磨板時只使用一對上磨刷，線路面向下，注意下磨刷要關(guān)閉；Useapairofupperscrubbingbrushforscrubbing.Putthecircuitsideadownandturnoffthenetherscrubbingbrush.E鋁面如有擦花，須用1000~1200#砂紙打磨平整后再磨板；IftherearescratchesontheAlsurface,itisnecessarytouse1000~1200#sandpapertosmooththeboardandthenconductscrubbing.F不能污染錫面，不能有啞色現(xiàn)象；TheTinsurfacemustn’tbepollutedandshouldn’thasdimcolor.G鋁面磨板要均勻，不能有沒磨到的地方；AllpartsoftheAlsurfacemustbescrubbedevenly.H在鋁面、錫面檢查合格后，鋁面須貼透明專用保護薄膜；PastespecialcolorlessprotectivefilmontheAlsurfaceaftertheAlandTinsurfacesareconfirmedtobequalified.景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第13頁共18頁13of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDate3.14V-CUTA使用電腦V-CUT；Applycomputer-assistantV-CUT.B在V-CUT過程中不能撕掉或揭開膠紙，更不能用手去摸鋁面；DuringthecourseofV-CUT,itmustn’tripofforuncoverthegummedpaperandtouchtheAlsurfacebyhand3.15成型MouldingA在沖壓過程中全程都不能撕掉或揭開膠紙，更不能用手去摸鋁面；Duringthewholeproduction,itmustn’tripofforuncoverthegummedpaperandtouchtheAlsurfacebyhand.B沖壓過程要從鋁面沖到線路面；Thepunching&pressingdirectionisfromAlsurfacetocircuitside.C鋁面不能有明顯的披鋒；Theremustn’tbeobviousbursontheAlsurface.D不能被壓傷，線路面不能有任何污染；Theboardmustn’tbebrokenwhenpressingandthecircuitsidemustn’tbepolluted.E不能有絕緣層脫落現(xiàn)象；Theinsulatedlayermustn’tbefallenoff.F外形及管位要符合設(shè)計的公差要求；Thetoleranceofoutlineandcontrollingpositionshouldbeconsistentwithdesignrequirement.G在沖壓過程中要注意模具上、下模的清潔，任何的金屬屑存在都會導(dǎo)致絕緣層的破壞，從而影響其電氣性能；Payattentiontocleaningtheupperandnethermoldsduringpunching&pressingforanymetalcrumbmayresultinthedamageofinsulatedlayerandinfluencetheelectricalcapacityofPCB.3.16高壓測試High-pressureTestA為了保證鋁基板有足夠的絕緣強度，需按客戶要求100%作耐高壓測試；InordertoassuresufficientinsulatedintensityforthealuminousPCB,thehigh-pressuretestmustbeoperatedaccordingtocustomer’srequirements.B耐壓測試電壓為1.65KV〔DC〕，漏電電流為2mA/PCS；Thepressureofhigh-pressuretestis1.65KV〔DC〕andthecreepagecurrentis2mA/PCS.景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第14頁共18頁14of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateC耐壓測試時如有漏電現(xiàn)象則需逐片測試，找出漏電單元；Ifthereiscreepageofhigh-pressuretest,itmusttestboardonebyonetofindoutthecreepageunit.D測試者要穿絕緣膠鞋，戴絕緣手套，以免中電；Testersmustwearinsulatedrubberovershoesandinsulatedglovestoavoidelectricalhurt.3.17OSPAOSP膜厚在要求范圍內(nèi)；TheOSPfilmthicknessmustbeintherequiredscope.BOSP膜均勻；TheOSPfilmshouldbeeven.C鋁面不能變色及劃傷。ThecolorofAlsurfacecannotbechangedandtheAlsurfacemustn’tbescratched.3.18FQC、FQA檢查FQCandFQACheckA按以下鋁基板品質(zhì)標(biāo)準結(jié)合客供標(biāo)準進展檢查ChecktheboardaccordingtothecombinationofaluminousPCBstandardbelowandcustomerstandard.B在檢查過程中將鋁面膠紙揭去，用白紙隔開存放；UncoverthegummedpaperontheAlsurfaceduringcheckingandseparatetheboardswithwhitepaper.C在檢查過程中不能污染鋁面和線路面；TheAlsurfaceandcircuitsidecannotbepollutedduringchecking.3.19包裝入庫Packing4.0品質(zhì)標(biāo)準〔客戶有要求按客戶要求〕QualityStandard(inaccordancewithcustomer’srequirementifthereisnecessity)線寬、線間距、焊盤變化±20%Toleranceoflinewidth,linegapandPAD±20%蝕刻系數(shù)≥1EtchingCoefficient≥1感光油厚度線路上25~50um，拐角處最小7.6umSensitivityoilthicknessOnthecircuit:25~50umAtthecorner:7.6um(minimum)感光油顏色均勻一致,但允許一定的輕微變化景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第15頁共18頁15of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateSensitivityoilcolorUnifiedbutslightdifferenceisallowed鉛錫焊劑厚度0.8~5umPb-Snsolderthickness0.8~5umOSP膜厚度0.3~0.6umOSPfilmthickness0.3~0.6um耐高壓測試1.65KV〔DC〕High-pressuretest1.65KV〔DC〕翹曲度1.5%Twistingdegree1.5%圖形面毛刺高度±0.13mmHeightofburonthepatternside±0.13mm孔徑公差±0.08mmHole-diametertolerance±0.08mm外形公差±0.10mmCosmetictolerance±0.10mm錫面平整、無啞色、無錫高、錫堆現(xiàn)象，MARK點要平整、光亮;TheTinsurfaceshouldbesmoothwithnodimcolor,highTinorTinpiling.Markpointshouldbeevenandbright.鋁面應(yīng)平整、無殘膠、氧化、水跡；TheAlsurfaceshouldbesmoothwithongluestains,oxidationorwaterstains.允許直徑小于0.5mm，深0.1mm的凹坑2個；2notchesatmostwithdiameter<0.5mmanddepth<0.1mmcanbeaccepted.允許有短的劃傷存在(未傷及基體)，長度小于40mm者數(shù)量少于5條；Shortnickscanbeaccepted(thenickhasn’thurtbasematerial).Thenumberofnickthatisshorterthan40mmisnomorethan5.劃傷(傷及基體)數(shù)量不超過1條，長度不超過20mm，深度不超過0.001mm。Thenumberofnickthathurtsbasematerialisnomorethan1anditslengthisnomorethan20mm景旺電子(深圳)KinwongElectronic(Shenzhen)Co.,ltd.文件名：DocumentTitle:鋁基板生產(chǎn)作業(yè)指導(dǎo)書WorkingInstructionofAluminousPCBProduction文件類別：DocumentType文件編號：DocumentNo.TD-ALU-01頁數(shù)：Page第16頁共18頁16of18pages作業(yè)指導(dǎo)書WorkingInstruction版本號：VersionNo.A生效日期：EffectiveDateanditsdepthisnomorethan0.001mm.5.0本卷須知Notice5.1各工序必須生產(chǎn)嚴格按要求操作；Allprocessesmustbestrictlyoperatedinaccordancewithrequirements.5.2生產(chǎn)全程中的運輸，必須插豬籠架，或者墊紙或膠片隔開，防止擦花；Putboardsinthecage-shelforseparatethemwithpaperorplasticsheettoavoidscratchesduringtransportationofthewholeproduction.5.3噴錫后的鋁基板不能接觸任何酸液和水；ThealuminousboardcannottouchacidliquidorwaterafterHALS.5.4生產(chǎn)全程中，任何工序都不能用刀片刮絕緣層；Usingknifetoscratchinsulatedlayerinanyprocessisnotallowedduringthewholeproduction.5.5對于報廢板，不能在基材上鉆孔，只能用黑油筆打“╳〞；Forabandonedboards,thebasematerialcannotbedrilledbutisonlymarkedwith“╳〞byoil-pen.5.6圖形檢查要做到全檢，任何圖形問題在蝕刻后都無法返工；5.7外發(fā)工序要嚴格按照我公司標(biāo)準進展來料全檢；Conduct100%IQCcheckforallout-sourcingboardsaccordingtoourcompany’sstandard.5.8成品錫面啞色、鋁面擦花等缺陷板集中起來，統(tǒng)一返工；Gatheralldefectiveboardstogether(suchasdimcolor&scratchesoftheAlsurface)tobere-processed.5.9生產(chǎn)中如有問題，要及時反響給相關(guān)工藝人員來解決。Foranyproblemduringproduction,itmustbeinformedtorelatedtechnicalstaffintimetobe