入門(mén)級(jí)專業(yè)英文詞匯.ppt

Page:1/15,PCB入門(mén)級(jí)專業(yè)英語(yǔ)詞匯,編制:工程MI組,日期:2013-11-15,Page:2/15,物料篇,Laminate層壓板Basematerial基材CCL(Copper-cladlaminate)覆銅板PP(Prepreg)膠片,預(yù)浸或半固化片,常用的有1080/2113/2116/7628等.Resin,EpoxyResin樹(shù)脂,環(huán)氧樹(shù)脂Wovenglassfabric玻璃纖維布Core芯板Copperfoil銅箔,主要使用的銅箔有HOZ/1OZ等.Rolledcopperfoil壓延銅箔THE銅箔(Hightemperatureelongationelectrodepositedcopperfoil)高延展性電解銅箔KraftPaper牛皮紙Peelablemask蘭膠Kaptontape高溫膠Carbonink碳油,Page:3/15,Soldermask/Solderresistink阻焊油墨Thermosettingtypeink熱固化油墨Silkscreen/Componentmark/Legend字符Solder,Tin/Leadsolder焊料,鉛錫焊料Drillbit,Routbit/millingcutter鉆咀,鑼刀,銑刀Chemical化學(xué)的Dryfilm干膜,是一種能感光,顯像,抗電鍍,抗蝕刻之阻劑TG(TemperatureofGlassTransition)玻璃態(tài)轉(zhuǎn)換溫度CTE(CoefficientofThermalExpansion)熱膨脹系數(shù)CTI(ComparativeTrackingIndex)相對(duì)漏電指數(shù)Anti-CAF(conductiveanodicfilament)耐離子遷移Dielectricconstant介電常數(shù)(DK/Er)TD(TemperatureofDecompose)熱裂分解溫度RoHS(RestrictionofHazardousSubstancesDirective)危害性物質(zhì)限制指令(Lead鉛,Mercury汞,Cadmium鎘,Chromium(VI)六價(jià)鉻,Polybrominatedbiphenyls(PBBs)多溴聯(lián)苯,Polybrominateddiphenylethers(PBDEs)多溴聯(lián)苯醚),Page:4/15,工藝篇,Laminatecutting開(kāi)料,裁板Baking烤板Desmear除膠渣PTH(Plated-Through-Hole)鍍通孔,也指沉銅Plasmacleaner等離子清洗Panelplating全板電鍍,也叫整板電鍍Patternplating圖形電鍍Imagetransfer圖形轉(zhuǎn)移TinStripping褪錫Etching蝕刻Undercut側(cè)蝕SES褪膜-蝕刻-褪錫連線(堿性蝕刻線)DES顯影-蝕刻-褪膜連線(酸性蝕刻線)Etchingfactor蝕刻因子(蝕刻系數(shù)),主要用來(lái)衡量側(cè)蝕量的大小,蝕刻因子=2*銅厚/(下線寬-上線寬),Page:5/15,Soldermaskprinting印阻焊Exposure曝光UVcureUV固化(ultraviolet)LPI(LiquidPhotoImage)液體感光成像Developing顯影Silkscreenstencil絲印鋼網(wǎng)，簡(jiǎn)稱絲網(wǎng)Aluminumsheet鋁片Scrubbing磨邊DIwater純水,去離子水(Deionization),由樹(shù)脂對(duì)無(wú)物理大顆粒的水體進(jìn)行陰陽(yáng)離子的吸附,常見(jiàn)的有鈣離子/氯離子/鎂離子等HASL(HotAirSolderingLevel)噴錫,熱風(fēng)整平LF-HASL(leadfree-hotairsolderinglevel)無(wú)鉛噴錫ENIG/Immersiongold沉金(沉鎳金,ElectrolessNickel/ImmersionGold)ENEPIG(electrolessnickelelectrolesspalladiumimmersiongold)沉鎳鈀金HDI(HighDensityInterconnector)高密度互連,Page:6/15,Flashgold水金(電薄金)Hardgold厚金ImmersionTin沉錫OSP/Entek(OrganicSolderabilityPreservatives)有機(jī)保焊劑,防氧化處理Immersionsilver沉銀Pressingprocess壓合工藝Brownoxidation棕化Layerup疊層,預(yù)疊板Laminationstructure壓合結(jié)構(gòu)LASER(LightAmplificationbyStimulatedEmissionofRadiation)鐳射,激光Registration對(duì)準(zhǔn)，對(duì)位,Page:7/15,OPE(OptilinePostEtch)內(nèi)層蝕刻對(duì)位沖孔機(jī)Rivet鉚釘/鉚合Fusion熱熔X-ray,X射線CCD(ChargeCoupledDevice)電荷耦合器件X-Ydimensionmachine二次元Label,Barcodelabel標(biāo)簽,條碼標(biāo)簽V-cut/V-score刻槽Rout鑼槽,鑼板Routing布線(route的ing形式),也指鑼槽,鑼板Punch沖板/啤板AOI(AutomatedOpticalInspection)自動(dòng)光學(xué)檢查Fly-probetest飛針測(cè)試UltrasonicCleaning超聲波清洗Microetching微蝕AspectRatio縱橫比,厚徑比,一般指板厚與最小孔孔徑的比值,Page:8/15,工程篇,Gerberdata:Gerber資料OriginalGerber原稿WorkingGerber工作稿，生產(chǎn)稿Specification規(guī)格,規(guī)范Fabricationdrawing制作圖紙Purchasingorder定單Technicalcard/form技術(shù)卡/表單Pad焊盤(pán)Isolationpad孤立焊盤(pán)Groundlayer接地層Powerlayer電源層Signallayer信號(hào)層Dielectric介質(zhì)層Impedance阻抗Single-endimpedance/Characteristicimpedance特性阻抗Differentialimpedance差分阻抗,Page:9/15,Coppercircuits線路Soldermaskopening阻焊開(kāi)窗Solderdam/soldermaskbridge阻焊橋ThermalVia導(dǎo)熱孔,散熱孔Teardrop淚滴Annularring焊環(huán)Beveling斜邊Chamfer斜邊,倒角Clearance清除(通常在內(nèi)層指隔離環(huán)clearanceland,在阻焊指開(kāi)窗soldermaskclearance)Viaholes導(dǎo)通孔Componentholes元件孔BGA(BallGridArray)矩陣式球墊表面裝組件IC(IntegratedCircuit)集成電路器Pitch節(jié)距,比如IC的節(jié)距,就是ICpad的中心距離VIP,ViainPad,盤(pán)中孔,Page:10/15,SMD(SurfaceMountDevice)表面貼裝組件(零件)SMT(SurfaceMountingTechnology)表面貼裝技術(shù)THT(Throughholetechnology)通孔插裝技術(shù)Artwork底片,菲林Break-awayarea/panelrail工藝邊Panel/Set/array套板Panelization排版Componentside元件面Solderside焊接面Soldering/Assembly裝配Fiducialmark光點(diǎn),定位光學(xué)點(diǎn),用于裝配時(shí)定位Slot槽FPC(FlexiblePrintedCircuits)軟性電路板(軟板)撓性印制板RigidPCB硬板Rigid-FlexPCB軟硬結(jié)合板Semi-FlexPCB半撓性板FR-4(FlameResistantLaminates)耐燃性積層板材,Page:11/15,Goldfingers金手指Connector連接器Press-fithole壓接孔,一般孔徑公差要求嚴(yán),插件的腳一般不需要焊接Stamphole/threadhole/mousebite郵票孔Blindhole盲孔Buriedhole埋孔Toolinghole工具孔,一般為NPTHX-out打X板,即有缺陷的板Counterbore沉頭孔Countersinking錐型擴(kuò)孔，嗽叭孔Drillmap/Drilldrawing/Holechart孔圖SPC(StatisticalProcessControl)統(tǒng)計(jì)制程管制Green綠色glossgreen光亮綠色mattegreen/dullgreen啞光綠色Compensate補(bǔ)償,Page:12/15,品質(zhì)篇,Tolerance/outoftolerance公差/超出公差Dimension尺寸Delamination分層,多指多層板的金屬層與樹(shù)脂之間的分離而言Dent凹痕/凹陷Wrinkle皺褶/起皺Holebreakout孔破Void空洞Nick缺口Pinhole針孔Wicking燈芯效應(yīng)Cleanliness清潔度IonCleanliness離子清潔度Etchback凹蝕NegativeEtchback負(fù)凹蝕,燈芯效應(yīng),Page:13/15,Electricaltest電測(cè)試Roughnessofholewall孔壁粗糙度Shelflife保質(zhì)期(沉金,噴錫板12個(gè)月,OSP,沉銀,沉錫6個(gè)月)Inspection檢查visualexamination目視檢查T(mén)hermalshocktest熱沖擊測(cè)試Solderabilitytest可焊性測(cè)試Edgediptest浸錫測(cè)試Solderfloattest浮錫測(cè)試Wavesoldertest波峰焊測(cè)試WettingBalance濕潤(rùn)平衡Conductorwidth導(dǎo)體寬度(線寬)Conductorspacing導(dǎo)體間距(線距),Page:14/15,Bowandtwist板彎板翹Scratch刮痕,刮傷Measling白斑Split裂紋Repair/rework