【SMT資料】SMT鋼板開孔案例分析ppt課件

1、1鋼板開孔鋼板開孔案例分析案例分析2 目目 錄錄一、 G/C 鋼板開孔設(shè)計規(guī)範二、無延伸腳類零件鋼板基本規(guī)範三、有延伸腳類零件鋼板基本規(guī)範四、BGA類鋼板基本規(guī)範五、Through Hole 零件鋼板基本規(guī)範 3H/2H2、鋼板厚度= 0.12mm or 0.15mm1、鋼網(wǎng)的光學點方式 a.黑色盲孔.光學點一概不貫穿. b.半蝕刻部份以黑色epoxy填滿一、一、 G/C 鋼板開孔設(shè)計規(guī)範鋼板開孔設(shè)計規(guī)範44、鋼板制造方法須用 Laser切割 ,並電拋光處理.3、鋼板張力 a.新的鋼板張力須35N/cm b.鋼板張力1.52.面積比(Area Ratio)=開口面積(LxW)/孔壁的面積 2x

2、(L+W)xT 0.668Y=0.558X=0.608D=0.965Y1=0.558X1=0.608 D1=1.1081. Chip R,C(0402),方形PAD,通常法一: X=X1=0.608 Y=Y1=0.558 D1=D+0.143=1.108二、無延伸腳類零件鋼板根本規(guī)範二、無延伸腳類零件鋼板根本規(guī)範9Y=0.77X=0.77D=0.66Y1=0.77X1=0.77=0.26D1=0.862.Chip R,L,C(0603),方形PAD, 通常法一: Y=Y1=0.77 X=X1=0.77 D=0.66 D1=D+0.2=0.86 =1/3*Y1=0.26 面積1/2 Y=Y1=1

3、.20 X=0.98mm X1=X-0.1=0.9710D=0.6Y=1.2X=0.983.Chip L,C(0603),橢圓形PAD,通常法一:D=0.6D1=D+0.15=0.75=1/3*Y1=0.4 面積1/2圓Y1=1.2X1=0.97=0.4D1=0.7511D=0.6Y=1.2X=0.984. Chip R(0603),橢圓形PAD,通常法二:Y=Y1=1.20X=X1=0.98D=0.6D1=D+0.2=0.8Y1=1.2X1=0.98D1=0.8125. Chip R,L,C(0805),方形PAD,通常法一: Y=Y1=1.28 X=1.1 X1=X-0.18=0.92 D

4、=0.77 D1=D+0.36=1.1 =1/3*Y1=0.42 面積1/2圓X=1.1Y=1.28D=0.77Y1=1.28X1=0.92=0.42D1=1.1313D=0.25Y=1.7X=1.78Y1=1.7X1=1.53=0.56D1=0.756. Chip L(0805),方形PAD,通常法一: Y=Y1=1.7 X=1.78 X1=X-0.25=1.53 D=0.25 D1=D+0.5=0.75 =1/3*Y1=0.56 面積1/2圓;14D=2.0Y=1.8X=1.03D1=2.0Y1=1.8X1=1.03=0.67.Chip R,L,C(1206),橢圓形PAD,通常法一: Y

5、=Y1=1.8 X=X1=1.03 D=D1=2.0 =1/3*Y1=0.6 面積1/2圓15D=1.52Y=2.18X=1.43Y1=2.18Y2=0.73X1=1.43D1=1.528. FUSE(1206),通常法一: Y=Y1=2.18 Y2=1/3*Y1=0.73 X=X1=1.43 D=D=1.5216Y1=2.18X2=0.72Y3=1.1X=1.43D=1.52X=1.43Y=2.189. FUSE(1206),通常法二: Y=Y1=2.18 X=X1=1.43 D=D1=1.52 X2=1/2*X=0.72 Y2=0.3 Y3=1.1Y2=0.3D1=1.5217X=2.68

6、Y=2.54D=0.77=0.84Y1=2.54X1=2.58 D1=0.9710.鋁質(zhì)電容與鉭質(zhì)電容共用PAD: Y=Y1=2.54 X1=X-0.1=2.58 D1=D+0.2=0.97 =1/3*Y1=0.84 面積1/2圓18Y1=1.88X1=2.5=0.62D1=1.2X=2.6 D=1.0Y=1.8811.鉭質(zhì)電容(1210),法一 Y=Y1=1.88 X=2.6 X1=X-0.1=2.5 D=1.0 D1=D+0.2=1.2 =1/3*Y1=0.62 面積1/2圓19Y=6.02X=5.87D=2.3X1=2.25Y1=2.3W=0.5W1=0.4D1=3.312. SOT25

7、2大顆及小顆功率晶體大PAD分成網(wǎng)格狀開孔 X=5.87 Y=6.02 D=2.3 X1=2.25 Y1=2.3 W=0.5 W1=0.4 D1=D+1.0=3.3 如圖所示20Y1=1.28X1=0.57 X2=0.45D1=0.7Y=1.28X= 0.57D=0.5D=0.213. CN (1206) 排容,通常法一: Y=Y1=1.28mm 向外移0.1mm X=X1=0.57mm D=0.2mm D=0.5mm X2=X1-0.12=0.45mm 縮孔且外移0.1mm D1=D+0.2=0.7mm21Y=0.6X=0.5D=0.2X=0.3X1=0.55Y1=0.6D1=0.25Y2=

8、0.7X2=0.2514. RN (0704) 排阻,通常法一: Y=0.6 X=0.5 D=0.2 X=0.3 Y1=0.6 X1=X+0.05=0.55 D1=D+0.05=0.25 Y2=Y+0.1=0.7 X2=X-0.05=0.25 縮孔 如圖所示,角落四角倒圓角22Y=1.02X=0.77D=0.5Y1=1.02X1=0.54D1=0.715. RN,CN(1206),法一: Y=Y1=1.02 X1=X-0.23=0.54 D=0.5 D1=D+0.2=0.7 角落四角倒圓角.中間四腳1:1開孔23Y=0.58X=0.52D=0.2D=0.45X=0.316.RN(0704 整體

9、特殊PAD)法一: Y=Y1=0.58 X=0.52 X1=X+0.05=0.57 D1=D=0.2 D=0.45 D2=D+0.05=0.25 Y3=Y+0.1=0.68 X1=X1=X=0.3 D3=D+0.1=0.55 角落四角導(dǎo)圓角D2=0.25Y1=0.58X1=0.57Y3=0.68D3=0.55X1=0.3D1=0.22417. RN(0805)排阻,通常法一: X=X-0.108=0.4 X3=X-0.208=0.3 X2=X-0.19=0.20 X1=X1-0.014=0.24 Y2=Y-0.1=0.5 Y=Y1=0.6 D1=D-0.309=0.4 四角成梯形X1=0.25

10、4mmY=0.6mmD=0.391mmX=0.508mmY1=0.6mmX=0.4mmX3=0.3mmX1=0.24mmX2=0.2mmY2=0.5mmD1=0.4mm25Y=1.28X=0.57D=0.2Y1=1.28X1=0.57 X2=0.45Y2=1.38D1=0.4518. 長寬開孔1:1,間距外移0.1角落四角導(dǎo)圓角 Y=Y1=1.28 ,X=X1=0.57 Y2=Y+0.1=1.38 X2=X-0.12=0.45 D=0.2 D1=D+0.25=0.452619. SOT223大顆及小顆功率晶體,通常法一:Y1=Y=8.35X1=X=3.8D1=D=0.78開孔1:1Y=8.35

11、X=3.8D=0.78X=1.55Y1=8.35X1=3.8D1=0.78X1=1.5527L=5.44W=1.7D=2.75L1=5.44W1=1.7D1=2.9520. 晶振 ,法一 L1=L=5.44 W1=W=1.7 D=2.75 D1=D+0.2=2.9528X=1.3Y=1.9X=1.3Y=1.921. 晶振 ,法二 X=X1=1.3 Y=Y2=1.9 開孔1:129Y1=1.28X1=1.28D1=0.65D1=1.1Y=1.28X=1.28D=0.65D=1.122. 三極管 Y=Y1=1.28 X=X1=1.28 D=D1=1.1 D=D1=0.65 開孔均1:130L=1.

12、9W=0.3D=0.2W1=0.2L1=1.0L2=0.71. Pitch=0.5mm ( QFP) L=1.9 W=0.3 L1=1.0 L2=0.7 D=0.2 W1=W-0.1=0.2 中間架橋0.2mm,寬0.2mm,且倒圓角, L1:L2=1:0.7 L1引腳部分,L1接近本體部分三、有延伸腳類零件鋼板根本規(guī)範三、有延伸腳類零件鋼板根本規(guī)範31L=2.0W=0.3D=0.2W1=0.2L1=1.0L2=0.8SOP&QFP2. Pitch0.65mm (SOJ SOP PLCC) L=L1=1.9 W=W1=0.65 開孔1:133L1=2.3W1=0.28L=2.3W=0.

13、4SOP&QFP4. Pitch=0.65mm (SOP, QFP) L=L1=2.3 長度開孔1:1 W=0.4 W1=W-0.12=0.28 縮孔 引腳倒圓角34X1=0.72Y1=0.44X=0.82Y=0.445. PLCC Y=Y1=0.44 X=0.82 X1=X-0.1=0.72 中間PAD部分不開孔35D=1.27=0.61=0.551. Pitch=1.27mm的BGA (CUP Socket) 原始焊盤的直徑=0.6 鋼板開孔直徑 1=-0.05=0.55四、四、BGA類鋼板根本規(guī)範類鋼板根本規(guī)範36=0.55pitch=1.27=0.62. Pitch=1.27m

14、m 的BGA 原始焊盤的直徑=0.6 鋼板開孔直徑 1=0.05=0.5537Pitch=1.03=0.42Pitch=1.01=0.42Pitch=1.272=0.423. Pitch=1.0mm 的BGA 原始焊盤直徑 =0.5 a.最外層陳列不規(guī)則 =0.42 b.第二層Pitch=1.0 鋼板開孔直徑 1=0.42 c.第三層Pitch=1.27但與Via Hole較近,鋼板開孔直徑 2=0.42 d.最里層Pitch=1.0 鋼板開孔直徑 1=0.4238=0.511=0.484. Pitch=1.0mm 的BGA (LAN CHIP) 原始焊盤的直徑=0.51 鋼板開孔直徑 1=-

15、0.03=0.4839=0.31=0.385. Pitch=0.8mm 的BGA (LAN CHIP) 原始焊盤的直徑=0.3 鋼板開孔直徑 1=+0.08=0.38 開方形四角導(dǎo)圓角401. Pin-in-Paste Through Hole 的鋼板規(guī)範: PTH PAD邊緣可Over Print的距離 OP 3.048mm 鋼板相鄰開口間距須Ds0.3048mm 鋼板開口與相鄰的StandOff運用區(qū)須距Ss0.127mm 鋼板開口與相鄰的測試點： (1)假設(shè)Test Point有開，Ts0.254mm (2)假設(shè)Test Point沒開，Ts0.127mm 鋼板開口須距板邊Be0.2286mm五、五、Through Hole 零件鋼板根本規(guī)範零件鋼板根本規(guī)範41OPDs Ss TsStandOff測試點板邊42DbDbd12dRpWsLs2. 假設(shè)Pin-in-Paste PTH的Drill直徑d0.305mm (泛指 Board Lock, Kink, Metal Post), 則: TOP SIDE: 其鋼板開口須劃分成四塊, 相鄰兩塊須距Db0.3048mm,