質(zhì)量控制計劃模板很實用

1、Printed copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reserved CONTROL PLANPlan Type ProcessPart NumberAll P/NPart/Proc #Process FlowchartProcess Name / Operationdescription1PCB preparation2Load PCB online3PrintingStencil printingPCB cleaningQuality c

2、heckYNPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedPickup & placementQuality checkReflow solderingAOIQuality checkYNYNRepair3PrintingPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All r

3、ights reservedAXIQuality checkManual insertionQuality checkRepairWave solderingPress in &assemblyQuality checkYNYNYNRepairRepair3PrintingYPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reserved4Pickup&PlacementQuality checkNext stepYNRe

4、pair3PrintingPress in &assemblyPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reserved5Reflow Soldering4Pickup&PlacementPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reserved6AOI

5、post-reflow5Reflow SolderingPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reserved7AXI8Manual Insertion9Wave Soldering10THT Press in and Assembly6AOI post-reflowPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens

6、Networks. All rights reserved10THT Press in and AssemblyPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedNumber Process Edited by SMT & THTPart NameCore team MembersModuleMachine, Device,Jig, Tools For Mfg.Product ProcessSpecialChar.C

7、lass.Product / Process Specification /ToleranceZebra PrinterPCB, labelPCB preparationPCB code checkLabel stickingSCLabel stick WIUpload conveyorPCBLoad PCBRefer to WIMaintenanceMaintenance WIMPM; DEKStencilStencil checkSCStencil apertures checkSCStencil tension checkStencil cleanness checkStencil cl

8、eaning WIMaintenanceMaintenance WI CONTROL PLANPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedPrinting programProgram checkRefer to SMD WI according to workorderParameter setting checkSCPrinting parameter & program crosstable online

9、support pin templateSupport pinSupport pin checkSupport pin placement templateMaintenanceMaintenance WIrefrigeratorGlueStorage TempSC010Warm up timeSC=2hoursMPM; DEKStencilMaintenanceMaintenance WIPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights

10、reservedrefrigerator, solderpaste mixerSolder pasteStorage TempSC010Warm up timeSC=4 hoursValid time after open SC=24hoursMix time3 minutesLifetimeSCRefer to the expired date on the labelMagnifier, cleaningmachinePrinting qualityAppearance checkSCPrinting defect referencePrinted copies are uncontrol

11、led, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedPCBCleaning checkPCB cleaning WIEquipmentMaintenanceMaintenance WIHS60; S27; F5HM;HS50; S25; F4S20;X4, SX4MachineProgram checkRefer to SMD WI of related moduleSW access rightSMT operator only use operatormodeMaterialM

12、aterial checkSCRefer to line setupCheck if Diplan machine stopfunction is enableReject rate controlHS50, HS600.25%S20,S25HM,S27HM0.35%F4,F5,F5HM1%X40.1%SX2=2hoursDEKStencilPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedrefrigerator, sol

13、derpaste mixerSolder pasteStorage TempSC010Warm up timeSC=4 hoursValid time after open SC=2hoursPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedPCBCleaning checkPCB cleaning WIEquipmentMaintenanceMaintenance WIFuji NXT M3Fuji NXT M6Machi

14、neProgram checkRefer to SMD WI of related moduleMaterialMaterial checkSCRefer to line setupCheck if Diplan machine stopfunction is enableReject rate control0.3%Top 5 high reject rate componentsMagnifier, cleaningmachine, SPIPrinting qualityAppearance checkSCPrinting defect referencePrinted copies ar

15、e uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedTop 20 high reject rate componentsEquipmentMaintenanceWIVI5000AOI programProgram checkRefer to SMD WI of related modulePlacement qualitycheckDefect confirmationPre-reflow defects checkingreferenceAppearance

16、 checkPre-reflow defects checkingreferenceEquipmentMaintenanceMaintenance WItweezers, magnifierPlacement qualitycheckComponent quality &position checkRefer to WIFuji NXT M3Fuji NXT M6MaterialReject rate controlPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Netw

17、orks. All rights reservedAppearance checkPre-reflow defects checkingreferenceBTUMachineProgram checkSCRefer to WO and SMD WI of relatedmoduleTemp. checkOven parameter & program crosstable onlineEquipmentMaintenanceMaintenance WIMagnifier,microscope,templatePlacement &soldering qualitycheckAp

18、pearance checkIPC-A-610DAuto 5D X-RayQualityAppearance checkIPC -A-610DEquipmentProgram checkRefer to WOtweezers, magnifierPlacement qualitycheckPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedMaintenanceMaintenance WIAuto 5D X-RayEquipm

19、entPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedDate Approved by Rev. DateCustomer Approval (If Required) Evaluation /MeasurementTechniqueRes.Sample SizeSample Freq.VisualOperator1each smallest packageVisualOperator100%all PCBs need t

20、o sticklabelManualOperator1all the same work orderManualMS, operator100%daily, weekly, monthly,quarterly, yearlyParchment paperMS100%1st time when stencilcome inTension meterMP100%each cleaned stencilIPQC12all cleanedstencils/once a shift(According to AQLstandard)MS100%1st time when stencilcome inVi

21、sual, MagnifierOperator100%each cleaned ones afterautomatically cleaningIPQC100%all cleanedstencils/once a shift CONTROL PLANPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedVisualOperator100%each stencil usedManualOperator100%daily maint

22、enance,each time usedTension meterMS100%once/ quarterlyVisualOperator1before production/eachsetup changeVisualIPQC1each setup change ManualIPQC1each setup change VisualOperator100%first 3pcs checkMS100%first 3pcs check afterprinting machineVisualOperator100%once/ line/ shiftDigital thermometerIPQC5o

23、nce a shiftManualShift leader100%each bottlePrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedIPQC12at least 1times(according to dailyproduction plan)Digital thermometerIPQC5once a shiftManualOperator100%each bottleIPQC12at least 1times/ l

24、ine(according to dailyproduction plan)ManualOperator100%each bottleIPQC12at least 1times/ line(according to dailyproduction plan)ManualOperator100%each bottleIPQC12once a shiftat least 1times/ line(according to dailyproduction plan)ManualOperator100%each bottleManualDedicated operator100%each bottle

25、Visual, magnifierOperator100%first 1pcs beforeproductionManualPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedOperator100%first 3pcs before volumeproductionOperator100%each moduleIPQC1each two hoursVisualOperator100%each cleaned PCBIPQCM

26、anualOperator,technician/engineer100%weekly, monthly,quarterly / yearlyVisualOperator1every batch IPQC1each setup change Mobile checkerOperator100%after componentrefillmentVisualIPQC12times/ shift/ lineOISMS100%each 2H checkLevel checksoftwareIPQC1two fixed times/ line/dayVisual, magnifierPrinted co

27、pies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedWeekly top20component listMS20once/ weekManualMS100%daily, weekly, monthly,quarterly, yearlyVisualOperator1each setup change IPQC1each setup change VisualOperator100%each moduleVisual, Magnifier,Micr

28、oscopeOperator100%first 3pcs before volumeproductionOperator100%each moduleIPQC100%first 3pcs before volumeproductionIPQC12random check based onAQL standard(according to dailyoutput qty)Manualengineer100%weekly, monthly,quarterly / yearlyManualOperator100%each modulePrinted copies are uncontrolled,

29、for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedVisualOperator100%each moduleVisualOperator1each setup change IPQC1each setup change VisualIPQC1each setup change ManualOperator/ MS100%weekly, monthly,quarterly / yearlydial indicator,test boardSupplier100%Once a yearVisu

30、alOperator100%each moduleIPQC100%first 3pcsIPQC12random check based onAQL standard(according to dailyoutput qty)IPQC3each 100pcsVisualOperator100%every board VisualOperator1before production/eachsetup changePrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. A

31、ll rights reservedManualengineer100%weekly, monthly,quarterly / yearlyPrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedDoc. No.: Efficient date: Date DateControl MethodReaction PlanCheck the code according to BOM.1. Stop using2. Feedback

32、to shift leaderFollow WI requirement to stick label online, especiallyfor label direction, check the label clearness.1. Stop sticking2. Feedback to shift leader1. Follow WI requirement to load PCB in correctdirection into upper loader machine.2. Use magazine to load PCB during B-sideproduction. PCB

33、should not over the mark onmagazine.3. Machine self-check.1. Reload PCB2. Feedback to online technicianFollow maintenance WI requirement to maintainequipment. Do the related record.Re-maintenance.Use parchment paper to visual check the aperture andrelated info on stencil.Return to supplierCheck sten

34、cil tension after stencil cleaningFeedback to shift leader right nowCheck stencil tension after stencil cleaning accordingto AQL standard.1. Feedback to MS.2. Record stencil # in related file in publicfolder.Use tension meter to check the stencil tension.Return to supplier1. Clean stencil offline ea

35、ch 45pcs module.2. Visual inspect if solder paste residue still stay onthe stencil. Check the stencil is in good condition.Put it back into washing machine and re-cleanVisual inspect all the stencils post shift used andmake record. Check the stencil is in good condition.1.Inform shift leader.2.Recor

36、d stencil # in related file in publicfolder. CONTROL PLANApproved by Customer Approval (If Required)Printed copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedScan the SN of stencil to ensure stencil No, is correctaccording to WI.1. Stop production

37、2. Feedback to shift leaderFollow maintenance WI requirement to maintainequipment. Do the related record.Re-maintenance.Follow maintenance WI requirement to maintainequipment. Use pressure meter to check stenciltension quarterly. Do the related record.Re-maintenance.Check the program himself accordi

38、ng to WIrequirement.Inform technicianCheck program based on WI and make record1. Hold production and inform shift leader.2. Record this case in related file in publicfolder.Check all key parameters according to Printingparameter & program cross table online1. Inform technician to double check, t

39、henreport to engineers.2. Record this case in related file in publicfolder.1. Choose right block according to WI requirement,2. Check SPI result accordingly.1. Inform engineer to adjust the pinposition.2. Do another 3pcs to check whether theproblem was solved.Technician double check before printing.

40、1. Re-adjust the support pin position2. Do another 3pcs to double check theresult.3. Inform engineer to modify template.Follow maintenance WI requirement to maintainequipment. No solder paste residue or pin damage.Stop using and scrap this support pin.Check and confirm the temperature onsite.1. Info

41、rm engineer at once2. Record checking result in related file inpublic folder.Record the take out time on label.1. Stop using if no time record.2. Scrap the gluePrinted copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedCheck and confirm the tempera

42、ture onsite.1. Inform process quality engineer or shiftleader immediately.2. Record check result in related file inpublic folder.Check and confirm the temperature onsite.1. Inform process quality engineer or shiftleader immediately.2. Record check result in related file inpublic folder.Record the ta

43、ke out time and sign on the label 1. Stop using if no time record.2. Feedback to shift leader.1. 100% check and confirm the temperature inwarming-up area.2. Random check the warm up time on site.1. Inform process quality engineer or shiftleader immediately.2. Record check result in related file inpu

44、blic folder.Check the time record in the label and calculate ifopen time is more than 24h before using.Discard the invalid solder pasteIPQC confirm the record in the label on-site.1, Inform operator to discard it.2. Record checking result in related file inpublic folder.1. Check whether the time set

45、ting time is 3 minsbefore mixing.2. Ensure each bottle should be mixed before using.1.Set to 3 minutes.2.Mix the solder pasteCheck the setting time. Check the time recorded onlabel.Record checking result in related file inpublic folder.Check the mix time which recorded on bottle.Record checking resu

46、lt in related file inpublic folder.Scan the solder paste SN automatically.1. Stop using2. Feedback to shift leaderCheck and record the expired date on the label.Arrange solder paste in refrigerator and follow FIFOperiodically.1,Stop using2,Inform ME&D and MS timelyStick film onto 1st pcs to ensu

47、re the printing quality.1.Inform technician to double check keyparameter setting,2.Print another one with film sticking.Printed copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedDobule check the defects according to SPIinformation.1.Inform technic

48、ian to double check keyparameter setting,2.Clean defective PCB3.Print another 3pcs to do FAIDobule check the defects according to SPIinformation.1.Inform technician, feedback to engineersif any parameter changed.2.Clean defective PCBMonitor SPI FPY.1.Ask operators do action for the findings.2,Hold p

49、roduction until the problem issolved.Shift leader record the related info( SN, reason, Line#)into PCB cleaning record.Pending this PCB in use.Use magnifier to inspect whether the PCB isacceptable (without solder paste residue, solder ball,etc) or not.1. Pending this PCB in use.2. Record checking res

50、ult in related file inpublic folder.Follow maintenance WI requirement to maintainequipment. Do the related record.Re-maintenance.Check the program himself according to WIrequirement.Inform technicianCheck program based on WI and make record1. Hold production and inform shift leader.2. Record this ca

51、se in related file in publicfolder.Operator shall scan the barcode of the componentsafter refillment.Mobile checker alarm, then take actions tosolve the problem.Check the symbol at the right corner of screen. Onlyyellow mark appears without red one. Ensure thestatus of the choice.1.Feedback to shift

52、 leader2.Record this case in SMT IPQC findingssummary sheet of share folder.Check material, pick up position,feeder,nozzle.Fix problem in 30 min. If not, feedback toengineers.1. Record component SAP code and reject rate inrelated file.2. Record the data 1H later to monitor whether thetrend is decrea

53、sed.1. Feedback to technician.2. Ask technician to fill the reason andimprovement action in related file.Printed copies are uncontrolled, for information onlyCopyright 2010 Nokia Siemens Networks. All rights reservedCheck top20 in weekly report from MPImprovement explanationFollow maintenance WI req

54、uirement to maintainequipment. Do the related record.Re-maintenance.Check the program himself according to WIrequirement.Inform technicianCheck program based on WI and make record1. Hold the production and inform the shiftleader.2. Record checking result in related file inpublic folder.According to

55、AOI info, manual confirm that whetherthe defect is false call or not.1. Repair the defect.2. Follow line stop principle.After AOI, do 100% visual inspection for these 3pcs.Use magnifier or microscope if needed.1. Record correct NC code into AOI.2. Repair the defect.Do judgment according to AOI info.

56、1. Record correct NC code into AOI.2. Repair the defect.3. Follow line stop principle.Do 100% visual inspection for these 3pcs. Usemagnifier or microscope if needed. Fill in the result inFAI tracing record.1. Feedback to technician to adjustequipment if needed.2. According to the checking result, de

57、cidewhether can start volume production. If not,another 3pcs should be produced todouble check whether the problem issolved.Mainly inspect polarity/missing/shift/solderingabnormality/coplanarity, random check during volumeproduction.1. Record the SN and related info of thedefective.2.Inform AOI operatorFollow maintenance WI requirement to maintaine